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一、Low temperature curing type silver paste

Model

Main component

Curing temperature

℃/min

Volume resistance

Adhesion

Kg/2×2㎜

Solid content

WT%

Recommended use

P-2113

Ag

100-150/10-30

2-3

≥1

60±1

PET film substrate, computer keyboard

P-2118

Ag

150/10-30

2-3

≥1

75-80

Welding of silver conductive adhesive

二、Touchscreen dedicated silver paste

Model

External view

Viscosity

Square resistance

Adhesion

Silver content

Recommended use

P-2632

Silver thick liquid

300±50

≤0.04Ω

100/100

70

Touchscreen silver paste

(Resistance type)

P-2001

Silver thick liquid

650±50

≤0.03Ω

100/100

75

Touchscreen silver paste

(Capacitance type)

三、Sintered silver paste

Model

Main component

The sintering temperature

Volume resistance

Adhesion

Kg/2×2㎜

Solid content

WT%

Recommended use

P-6001

Ag

350~600

2-3

≥3

65-75

Glass ceramic matrix electrode

P-7001

65-75

P-7032

75-80

P-7038

70-80

P-8001

Ag

600~850

2-3

≥4

70-80

High frequency ceramic, alumina matrix,

Ferrite based electrode

P-8013

70-80

P-8026

70-80

P-8028

70-80

P-8628

70-80

四、Special slurry

Model

Main component

Curing temperature

Volume resistance

Adhesion

Kg/2×2㎜

Solid content

WT%

Recommended use

P-600A

AL

150-200

70-75

Alumina slurry

P-600T

C

1750-850

70-80

Aluminum solar plasma

P-600L

AL

620±20

70-75

PTC aluminum

P-600

C

150-180

20-40

Carbon paste


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